Lucas123 writes: Toshiba has begun shipping samples of its third-generation 3D NAND memory product, a chip with 64 stacked flash cells that it said will enable a 1TB chip shipping later this spring. The new flash memory product has 65% greater capacity than the previous generation technology, which used 48 layers of NAND flash cells. The chip will be used in data centers and consumer SSD products. The technology announcement comes even as suitors are eyeing buying a majority share of the company’s memory business. Along with a previous report about Western Digital, Foxxcon, SK Hynix and Micron Technology have now also thrown their hats in the ring to purchase a majority share in Toshiba’s memory spin-off, according to a new report in the Nikkei’s Asian Review.
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